DS26LS32MW/883
vs
AM26LS32/BEA
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
PHILIPS SEMICONDUCTORS
|
| Package Description |
DFP, FL16,.3
|
DIP-16
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Driver Number of Bits |
4
|
|
| Input Characteristics |
DIFFERENTIAL SCHMITT TRIGGER
|
|
| Interface IC Type |
LINE RECEIVER
|
LINE RECEIVER
|
| Interface Standard |
EIA-422; EIA-423; FED STD 1020; FED STD 1030
|
|
| JESD-30 Code |
R-GDFP-F16
|
R-XDIP-T16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
9.6645 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Characteristics |
3-STATE
|
|
| Output Low Current-Max |
0.008 A
|
0.008 A
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC
|
| Package Code |
DFP
|
DIP
|
| Package Equivalence Code |
FL16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Receive Delay-Max |
25 ns
|
38 ns
|
| Receiver Number of Bits |
4
|
|
| Screening Level |
MIL-STD-883
|
38535Q/M;38534H;883B
|
| Seated Height-Max |
2.032 mm
|
|
| Supply Current-Max |
70 mA
|
70 mA
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
4.5 V
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
FLAT
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
6.35 mm
|
|
| Base Number Matches |
2
|
3
|
|
|
|
Compare DS26LS32MW/883 with alternatives
Compare AM26LS32/BEA with alternatives