DS26LS32MJ/883B vs HD26LS32P feature comparison

DS26LS32MJ/883B National Semiconductor Corporation

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HD26LS32P Hitachi Ltd

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP HITACHI LTD
Package Description DIP, DIP16,.3 DIP,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Driver Number of Bits 4
Input Characteristics DIFFERENTIAL SCHMITT TRIGGER DIFFERENTIAL SCHMITT TRIGGER
Interface IC Type LINE RECEIVER LINE RECEIVER
Interface Standard EIA-422; EIA-423; FED STD 1020; FED STD 1030 EIA-422-A; EIA-423-A
JESD-30 Code R-GDIP-T16 R-PDIP-T16
JESD-609 Code e0
Length 19.43 mm 19.2 mm
Number of Functions 1 4
Number of Terminals 16 16
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Output Characteristics 3-STATE
Output Low Current-Max 0.008 A
Output Polarity TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Receive Delay-Max 30 ns 25 ns
Receiver Number of Bits 4 4
Screening Level MIL-STD-883 Class B
Seated Height-Max 5.08 mm 5.06 mm
Supply Current-Max 70 mA
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 3 2
Part Package Code DIP
Pin Count 16

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