DS26LS32MJ/883
vs
5962-7802001MEA
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Contact Manufacturer
Transferred
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
PHILIPS SEMICONDUCTORS
Part Package Code
DIP
Package Description
CERAMIC, DIP-16
DIP-16
Pin Count
16
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Driver Number of Bits
4
Input Characteristics
DIFFERENTIAL SCHMITT TRIGGER
Interface IC Type
LINE RECEIVER
LINE RECEIVER
Interface Standard
EIA-422; EIA-423; FED STD 1020; FED STD 1030
JESD-30 Code
R-GDIP-T16
R-XDIP-T16
Length
19.43 mm
Moisture Sensitivity Level
1
Number of Functions
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Characteristics
3-STATE
Output Low Current-Max
0.008 A
0.008 A
Output Polarity
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Receive Delay-Max
25 ns
38 ns
Receiver Number of Bits
4
Screening Level
MIL-STD-883
38535Q/M;38534H;883B
Seated Height-Max
5.08 mm
Supply Current-Max
70 mA
70 mA
Supply Voltage-Max
5.5 V
Supply Voltage-Min
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
Base Number Matches
3
10
JESD-609 Code
e0
Terminal Finish
Tin/Lead (Sn/Pb) - hot dipped
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