DS26LS31MJ-MLS vs AM26LS31CN feature comparison

DS26LS31MJ-MLS National Semiconductor Corporation

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AM26LS31CN YAGEO Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP PHILIPS COMPONENTS
Package Description DIP, DIP16,.3 DIP-16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Differential Output YES YES
Driver Number of Bits 4 4
High Level Input Current-Max 0.00002 A
Input Characteristics STANDARD STANDARD
Interface IC Type LINE DRIVER LINE DRIVER
Interface Standard EIA-422; FED STD 1020 EIA-422; FED STD 1020
JESD-30 Code R-GDIP-T16 R-PDIP-T16
JESD-609 Code e0
Length 19.43 mm
Number of Functions 4 4
Number of Terminals 16 16
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Out Swing-Min 2 V
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Receive Delay-Max
Screening Level 38535V;38534K;883S
Seated Height-Max 5.08 mm
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Transmit Delay-Max 15 ns 20 ns
Width 7.62 mm
Base Number Matches 1 1
Output Polarity COMPLEMENTARY
Supply Current-Max 80 mA

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Compare AM26LS31CN with alternatives