DS26LS31CJ vs DS96F174MMD8 feature comparison

DS26LS31CJ Texas Instruments

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DS96F174MMD8 National Semiconductor Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Package Description DIP, DIP16,.3 DIE, DIE OR CHIP
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Differential Output YES YES
Driver Number of Bits 4 4
High Level Input Current-Max 0.00002 A 0.00002 A
Input Characteristics STANDARD STANDARD
Interface IC Type LINE DRIVER LINE DRIVER
Interface Standard EIA-422; FED STD 1020 EIA-422; EIA-485
JESD-30 Code R-GDIP-T16 X-XUUC-N
JESD-609 Code e0
Length 19.43 mm
Number of Functions 1 4
Number of Terminals 16
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Out Swing-Min 2 V 1.5 V
Output Characteristics 3-STATE 3-STATE
Output Polarity COMPLEMENTARY
Package Body Material CERAMIC, GLASS-SEALED UNSPECIFIED
Package Code DIP DIE
Package Equivalence Code DIP16,.3 DIE OR CHIP
Package Shape RECTANGULAR UNSPECIFIED
Package Style IN-LINE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Receive Delay-Max
Seated Height-Max 5.08 mm
Supply Current-Max 60 mA
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Transmit Delay-Max 15 ns 25 ns
Width 7.62 mm
Base Number Matches 2 2
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Screening Level 38535Q/M;38534H;883B
Time@Peak Reflow Temperature-Max (s) 40

Compare DS26LS31CJ with alternatives

Compare DS96F174MMD8 with alternatives