DS26F31MJ
vs
AM26LS31DMB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
ADVANCED MICRO DEVICES INC
Package Description
DIP, DIP16,.3
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Differential Output
YES
YES
Driver Number of Bits
4
4
High Level Input Current-Max
0.00002 A
0.00002 A
Input Characteristics
STANDARD
STANDARD
Interface IC Type
LINE DRIVER
LINE DRIVER
Interface Standard
EIA-422; FED STD 1020
EIA-422; FED STD 1020
JESD-30 Code
R-GDIP-T16
R-GDIP-T16
JESD-609 Code
e0
e0
Length
19.43 mm
19.431 mm
Number of Functions
1
4
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Out Swing-Min
2 V
2 V
Output Characteristics
3-STATE
3-STATE
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Receive Delay-Max
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Transmit Delay-Max
15 ns
30 ns
Width
7.62 mm
7.62 mm
Base Number Matches
3
2
Part Package Code
DIP
Pin Count
16
Screening Level
MIL-STD-883 Class B (Modified)
Compare DS26F31MJ with alternatives
Compare AM26LS31DMB with alternatives