DS26C31ME/883
vs
DS26LS31MJ-QMLV
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Package Description
QCCN, LCC20,.35SQ
CERAMIC, DIP-16
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Differential Output
YES
YES
Driver Number of Bits
4
4
High Level Input Current-Max
0.000001 A
0.00002 A
Input Characteristics
STANDARD
STANDARD
Interface IC Type
LINE DRIVER
LINE DRIVER
Interface Standard
EIA-422
EIA-422; FED STD 1020
JESD-30 Code
S-CQCC-N20
R-GDIP-T16
Length
8.89 mm
19.43 mm
Moisture Sensitivity Level
1
1
Number of Functions
4
4
Number of Terminals
20
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Out Swing-Min
2 V
2 V
Output Characteristics
3-STATE
3-STATE
Output Polarity
COMPLEMENTARY
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
QCCN
DIP
Package Equivalence Code
LCC20,.35SQ
DIP16,.3
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Receive Delay-Max
Screening Level
MIL-STD-883
MIL-PRF-38535 Class V
Seated Height-Max
1.905 mm
5.08 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
BIPOLAR
Temperature Grade
MILITARY
MILITARY
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Transmit Delay-Max
14 ns
20 ns
Width
8.89 mm
7.62 mm
Base Number Matches
2
2
JESD-609 Code
e0
Peak Reflow Temperature (Cel)
260
Terminal Finish
Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s)
40
Compare DS26C31ME/883 with alternatives
Compare DS26LS31MJ-QMLV with alternatives