DS26556N
vs
DS34S108GN+
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Not Recommended
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
ANALOG DEVICES INC
|
Part Package Code |
BGA
|
484-BGA-23X23X1.53?
|
Package Description |
17 X 17 MM, 1 MM PITCH, BGA-256
|
ROHS COMPLIANT, HSBGA-484
|
Pin Count |
256
|
484
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Carrier Type |
CEPT PCM-30/E-1
|
|
Carrier Type (2) |
T-1(DS1)
|
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B484
|
JESD-609 Code |
e0
|
e1
|
Length |
17 mm
|
23 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
256
|
484
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA256,16X16,40
|
BGA484,22X22,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.76 mm
|
2.41 mm
|
Supply Current-Max |
875 mA
|
280 mA
|
Supply Voltage-Nom |
3.3 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
FRAMER
|
FRAMER
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
17 mm
|
23 mm
|
Base Number Matches |
1
|
1
|
Manufacturer Package Code |
|
484-BGA-23X23X1.53?
|
Date Of Intro |
|
2008-04-28
|
Samacsys Manufacturer |
|
Analog Devices
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare DS26556N with alternatives
Compare DS34S108GN+ with alternatives