DS26556N
vs
DS33R11
feature comparison
All Stats
Differences Only
Pbfree Code
No
No
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
MAXIM INTEGRATED PRODUCTS INC
Part Package Code
BGA
BGA
Package Description
17 X 17 MM, 1 MM PITCH, BGA-256
27 X 27 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-256
Pin Count
256
256
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Carrier Type
CEPT PCM-30/E-1
Carrier Type (2)
T-1(DS1)
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e0
Length
17 mm
27 mm
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
256
256
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.76 mm
2.54 mm
Supply Current-Max
875 mA
Supply Voltage-Nom
3.3 V
1.8 V
Surface Mount
YES
YES
Telecom IC Type
FRAMER
FRAMER
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
17 mm
27 mm
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
245
Technology
BIPOLAR
Compare DS26556N with alternatives
Compare DS33R11 with alternatives