DS26518
vs
DS34S104GN+
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Not Recommended
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
|
Part Package Code |
BGA
|
256-CSP_BGA-17X17X1.26
|
Package Description |
17 X 17 MM, 1.00 MM, PITCH, TE-CSBGA-256
|
|
Pin Count |
256
|
256
|
Reach Compliance Code |
compliant
|
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
JESD-30 Code |
S-XBGA-B256
|
S-PBGA-B256
|
JESD-609 Code |
e0
|
e1
|
Length |
17 mm
|
17 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.76 mm
|
1.76 mm
|
Supply Current-Max |
450 mA
|
280 mA
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
FRAMER
|
FRAMER
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
9
|
1
|
Manufacturer Package Code |
|
256-CSP_BGA-17X17X1.26
|
Date Of Intro |
|
2008-04-28
|
Samacsys Manufacturer |
|
Analog Devices
|
Moisture Sensitivity Level |
|
3
|
Package Equivalence Code |
|
BGA256,16X16,40
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare DS26518 with alternatives
Compare DS34S104GN+ with alternatives