DS2502X1+
vs
DS2502R+T&R
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
MAXIM INTEGRATED PRODUCTS INC
Part Package Code
BGA
SOT-23
Package Description
VBGA, BGA4,2X2,37/16
TSSOP, TO-236
Pin Count
2
3
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.32.00.71
Access Time-Max
15000 ns
15000 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PBGA-B2
R-PDSO-G3
JESD-609 Code
e2
e3
Length
1.6 mm
2.92 mm
Memory Density
1024 bit
1024 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
8
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
2
3
Number of Words
128 words
128 words
Number of Words Code
128
128
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128X8
128X8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VBGA
TSSOP
Package Equivalence Code
BGA4,2X2,37/16
TO-236
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.639 mm
1.12 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2.8 V
2.8 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER NICKEL
MATTE TIN
Terminal Form
BALL
GULL WING
Terminal Pitch
0.933 mm
0.95 mm
Terminal Position
BOTTOM
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
0.91 mm
1.3 mm
Base Number Matches
2
2
Additional Feature
MICROLAN COMPATIBLE
Compare DS2502X1+ with alternatives
Compare DS2502R+T&R with alternatives