DS2502V
vs
DS2502P
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
DALLAS SEMICONDUCTOR
MAXIM INTEGRATED PRODUCTS INC
Package Description
TSOC-6
TSOC-6
Reach Compliance Code
unknown
not_compliant
Access Time-Max
15000 ns
15000 ns
Additional Feature
MICROLAN COMPATIBLE
MICROLAN COMPATIBLE
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDSO-C6
R-PDSO-C6
JESD-609 Code
e0
e0
Memory Density
1024 bit
1024 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
6
6
Number of Words
128 words
128 words
Number of Words Code
128
128
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128X8
128X8
Output Characteristics
OPEN-DRAIN
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOC
SOC
Package Equivalence Code
SOC6,.17
SOC6,.17
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2.8 V
2.8 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn85Pb15)
Terminal Form
C BEND
C BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
2
Part Package Code
SOIC
Pin Count
6
ECCN Code
EAR99
HTS Code
8542.32.00.71
Length
3.94 mm
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
240
Seated Height-Max
1.5 mm
Time@Peak Reflow Temperature-Max (s)
20
Width
3.76 mm
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