DS2406X
vs
DS28E01X-100-S
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
CSP-6
|
VFBGA,
|
| Pin Count |
6
|
6
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.51
|
| JESD-30 Code |
R-PBGA-B6
|
R-PBGA-B6
|
| JESD-609 Code |
e0
|
e0
|
| Length |
2.85 mm
|
1.98 mm
|
| Memory Density |
1024 bit
|
1024 bit
|
| Memory IC Type |
OTP ROM
|
EEPROM
|
| Memory Width |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
6
|
| Number of Words |
1024 words
|
1024 words
|
| Number of Words Code |
1000
|
1000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
1KX1
|
1KX1
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VBGA
|
VFBGA
|
| Package Equivalence Code |
FLIP CHIP
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.864 mm
|
0.67 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
2.8 V
|
2.8 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.2 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
1.91 mm
|
1.75 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Serial Bus Type |
|
1-WIRE
|
|
|
|
Compare DS2406X with alternatives
Compare DS28E01X-100-S with alternatives