DS2182Q
vs
TSS933EASC
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
TEMIC SEMICONDUCTORS
|
Package Description |
PLASTIC, LCC-28
|
MQFPJ-28
|
Reach Compliance Code |
compliant
|
unknown
|
JESD-30 Code |
S-PQCC-J28
|
S-XQFP-G28
|
JESD-609 Code |
e0
|
|
Length |
11.505 mm
|
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
QCCJ
|
|
Package Equivalence Code |
LDCC28,.5SQ
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
BICMOS
|
Telecom IC Type |
FRAMER
|
FRAMER
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
J BEND
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
QUAD
|
QUAD
|
Width |
11.505 mm
|
|
Base Number Matches |
3
|
1
|
|
|
|
Compare DS2182Q with alternatives
Compare TSS933EASC with alternatives