TSS933EASC
vs
TSS933EASB
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEMIC SEMICONDUCTORS
|
TEMIC SEMICONDUCTORS
|
| Package Description |
MQFPJ-28
|
MQFPJ-28
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-30 Code |
S-XQFP-G28
|
S-XQFP-G28
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Telecom IC Type |
FRAMER
|
FRAMER
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare TSS933EASC with alternatives
Compare TSS933EASB with alternatives