DS2175SN
vs
DS2175S
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
DALLAS SEMICONDUCTOR
|
| Part Package Code |
SOIC
|
|
| Package Description |
0.300 INCH, SOIC-16
|
0.300 INCH, SOIC-16
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
10.3 mm
|
10.3 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
2.65 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
ELASTIC BUFFER
|
ELASTIC BUFFER
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.5 mm
|
7.5 mm
|
| Base Number Matches |
3
|
3
|
| Package Equivalence Code |
|
SOP16,.4
|
| Supply Current-Max |
|
16 mA
|
|
|
|
Compare DS2175SN with alternatives