DS21458+
vs
DS21458
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
DALLAS SEMICONDUCTOR
|
| Part Package Code |
BGA
|
|
| Package Description |
17 X 17 MM, 1 MM PITCH, LEAD FREE, CSBGA-256
|
|
| Pin Count |
256
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| JESD-30 Code |
S-PBGA-B256
|
|
| JESD-609 Code |
e1
|
|
| Length |
17 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
256
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LBGA
|
|
| Package Equivalence Code |
BGA256,16X16,40
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.5 mm
|
|
| Supply Voltage-Nom |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
BIPOLAR
|
|
| Telecom IC Type |
FRAMER
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Width |
17 mm
|
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare DS21458+ with alternatives