DS21458+
vs
DS21458N+
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
17 X 17 MM, 1 MM PITCH, LEAD FREE, CSBGA-256
|
17 X 17 MM, 1 MM PITCH, LEAD FREE, CSBGA-256
|
Pin Count |
256
|
256
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
JESD-609 Code |
e1
|
e3
|
Length |
17 mm
|
17 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.5 mm
|
1.5 mm
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
BIPOLAR
|
Telecom IC Type |
FRAMER
|
FRAMER
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
MATTE TIN
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare DS21458+ with alternatives
Compare DS21458N+ with alternatives