DS2143 vs MH89790BN1 feature comparison

DS2143 Maxim Integrated Products

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MH89790BN1 Microsemi Corporation

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MAXIM INTEGRATED PRODUCTS INC ZARLINK SEMICONDUCTOR INC
Part Package Code DIP DIP
Package Description 0.600 INCH, DIP-40 DIP,
Pin Count 40 40
Reach Compliance Code not_compliant compliant
ECCN Code EAR99
HTS Code 8542.31.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Carrier Type CEPT PCM-30/E-1
JESD-30 Code R-PDIP-T40 R-PDIP-T40
JESD-609 Code e0 e3
Length 52.075 mm 50.8 mm
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 40 40
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP40,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS
Telecom IC Type FRAMER FRAMER
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 20.32 mm
Base Number Matches 10 1
Supply Current-Max 45 mA

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