DS2003CM/NOPB
vs
KID65003AF
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
KEC CORP
Part Package Code
SOIC
FLIP-CHIP
Package Description
SOIC-16
SMALL OUTLINE, R-PDSO-G16
Pin Count
16
16
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
Samacsys Manufacturer
Texas Instruments
Additional Feature
LOGIC LEVEL COMPATIBLE
BULIT-BIAS RESISTOR, LOGIC LEVEL COMPATIBLE
Collector Current-Max (IC)
0.5 A
0.5 A
Collector-Emitter Voltage-Max
55 V
50 V
Configuration
COMPLEX
COMPLEX
JEDEC-95 Code
MS-012AC
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e3
Moisture Sensitivity Level
1
Number of Elements
7
7
Number of Terminals
16
16
Operating Temperature-Max
150 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Polarity/Channel Type
NPN
NPN
Qualification Status
Not Qualified
Surface Mount
YES
YES
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Transistor Application
SWITCHING
SWITCHING
Transistor Element Material
SILICON
SILICON
Turn-off Time-Max (toff)
1000 ns
Turn-on Time-Max (ton)
1000 ns
Base Number Matches
1
3
DC Current Gain-Min (hFE)
1000
Compare DS2003CM/NOPB with alternatives
Compare KID65003AF with alternatives