KID65003AF
vs
TD62003AF
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
KEC CORP
TOSHIBA CORP
Part Package Code
FLIP-CHIP
SOIC
Package Description
SMALL OUTLINE, R-PDSO-G16
SMALL OUTLINE, R-PDSO-G16
Pin Count
16
16
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
Additional Feature
BULIT-BIAS RESISTOR, LOGIC LEVEL COMPATIBLE
Collector Current-Max (IC)
0.5 A
0.5 A
Collector-Emitter Voltage-Max
50 V
50 V
Configuration
COMPLEX
COMPLEX
DC Current Gain-Min (hFE)
1000
1000
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Number of Elements
7
7
Number of Terminals
16
16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Polarity/Channel Type
NPN
NPN
Surface Mount
YES
YES
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Transistor Application
SWITCHING
SWITCHING
Transistor Element Material
SILICON
SILICON
Base Number Matches
1
2
Pbfree Code
HTS Code
8541.21.00.95
JESD-609 Code
e0
Operating Temperature-Max
85 °C
Power Dissipation Ambient-Max
0.625 W
Qualification Status
Not Qualified
Terminal Finish
TIN LEAD
VCEsat-Max
1.6 V
Compare KID65003AF with alternatives
Compare TD62003AF with alternatives