DS1250ABP-100IND vs P4C1256L-70DI feature comparison

DS1250ABP-100IND Maxim Integrated Products

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P4C1256L-70DI Pyramid Semiconductor Corporation

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Active Active
Ihs Manufacturer MAXIM INTEGRATED PRODUCTS INC PYRAMID SEMICONDUCTOR CORP
Part Package Code DMA DIP
Package Description POWERCAP MODULE-34 0.300 INCH, CERAMIC, DIP-28
Pin Count 34 28
Reach Compliance Code not_compliant unknown
Access Time-Max 100 ns 70 ns
Additional Feature 10 YEAR DATA RETENTION LG-MAX
JESD-30 Code R-XDMA-U34 R-CDIP-T28
JESD-609 Code e0 e0
Memory Density 4194304 bit 262144 bit
Memory IC Type NON-VOLATILE SRAM MODULE STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 34 28
Number of Words 524288 words 32768 words
Number of Words Code 512000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512KX8 32KX8
Package Body Material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package Equivalence Code MODULE,34LEAD,1.0
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 NOT SPECIFIED
Power Supplies 5 V
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.005 A
Supply Current-Max 0.085 mA
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form J INVERTED THROUGH-HOLE
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Base Number Matches 3 4
Length 37.719 mm
Package Code DIP
Seated Height-Max 5.715 mm
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare DS1250ABP-100IND with alternatives

Compare P4C1256L-70DI with alternatives