DS1250AB-100IND
vs
DS1247Y-100
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
DALLAS SEMICONDUCTOR
|
| Part Package Code |
MODULE
|
|
| Package Description |
DIP, DIP32,.6
|
|
| Pin Count |
32
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
|
| HTS Code |
8473.30.11.40
|
|
| Access Time-Max |
100 ns
|
100 ns
|
| Additional Feature |
10 YEAR DATA RETENTION
|
DATA RETENTION = 10 YRS
|
| JESD-30 Code |
R-XDMA-P32
|
R-XDIP-T32
|
| JESD-609 Code |
e0
|
|
| Memory Density |
4194304 bit
|
4194304 bit
|
| Memory IC Type |
NON-VOLATILE SRAM MODULE
|
NON-VOLATILE SRAM MODULE
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Number of Words |
524288 words
|
524288 words
|
| Number of Words Code |
512000
|
512000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
512KX8
|
512KX8
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP32,.6
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Standby Current-Max |
0.005 A
|
|
| Supply Current-Max |
0.085 mA
|
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
PIN/PEG
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
2
|
| Number of Ports |
|
1
|
| Output Characteristics |
|
3-STATE
|
| Output Enable |
|
YES
|
|
|
|
Compare DS1250AB-100IND with alternatives
Compare DS1247Y-100 with alternatives