DS1230Y-70IND
vs
DS1230Y-70
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
MAXIM INTEGRATED PRODUCTS INC
Part Package Code
MODULE
DIP
Package Description
0.740 INCH, DIP-28
0.740 INCH, DIP-28
Pin Count
28
28
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8473.30.11.40
8473.30.11.40
Access Time-Max
70 ns
70 ns
JESD-30 Code
R-XDMA-P28
R-XDMA-P28
JESD-609 Code
e0
e0
Memory Density
262144 bit
262144 bit
Memory IC Type
NON-VOLATILE SRAM MODULE
NON-VOLATILE SRAM MODULE
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
32KX8
32KX8
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.6
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.005 A
0.005 A
Supply Current-Max
0.085 mA
0.085 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
4
Factory Lead Time
4 Weeks
Additional Feature
10 YEARS DATA RETENTION PERIOD
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
240
Time@Peak Reflow Temperature-Max (s)
20
Compare DS1230Y-70IND with alternatives
Compare DS1230Y-70 with alternatives