DS1230Y-70
vs
DS1230AB-70
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
MAXIM INTEGRATED PRODUCTS INC
Part Package Code
DIP
DIP
Package Description
0.740 INCH, DIP-28
0.740 INCH, DIP-28
Pin Count
28
28
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8473.30.11.40
8542.32.00.41
Factory Lead Time
4 Weeks
Access Time-Max
70 ns
70 ns
Additional Feature
10 YEARS DATA RETENTION PERIOD
10 YEARS DATA RETENTION PERIOD
JESD-30 Code
R-XDMA-P28
R-XDMA-P28
JESD-609 Code
e0
e0
Memory Density
262144 bit
262144 bit
Memory IC Type
NON-VOLATILE SRAM MODULE
NON-VOLATILE SRAM MODULE
Memory Width
8
8
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32KX8
32KX8
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.6
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.005 A
0.005 A
Supply Current-Max
0.085 mA
0.12 mA
Supply Voltage-Max (Vsup)
5.5 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
Base Number Matches
3
2
Compare DS1230Y-70 with alternatives
Compare DS1230AB-70 with alternatives