DPSD64ME8WKY5-DP-XX08
vs
K4H510838B-NLB30
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
DPAC TECHNOLOGIES CORP
|
SAMSUNG SEMICONDUCTOR INC
|
| Part Package Code |
TSOP2
|
TSOP2
|
| Package Description |
ATSOP2,
|
TSSOP,
|
| Pin Count |
54
|
54
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.28
|
8542.32.00.28
|
| Access Mode |
FOUR BANK PAGE BURST
|
FOUR BANK PAGE BURST
|
| Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
| JESD-30 Code |
R-PDSO-G54
|
R-PDSO-G54
|
| Memory Density |
536870912 bit
|
536870912 bit
|
| Memory IC Type |
SYNCHRONOUS DRAM MODULE
|
DDR1 DRAM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
54
|
54
|
| Number of Words |
67108864 words
|
67108864 words
|
| Number of Words Code |
64000000
|
64000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Organization |
64MX8
|
64MX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
ATSOP2
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, PIGGYBACK, THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.59 mm
|
1.2 mm
|
| Self Refresh |
YES
|
YES
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.4 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| Access Time-Max |
|
0.7 ns
|
| JESD-609 Code |
|
e0
|
| Length |
|
11.2 mm
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Supply Voltage-Max (Vsup) |
|
2.7 V
|
| Supply Voltage-Min (Vsup) |
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
|
2.5 V
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
TIN LEAD
|
| Width |
|
10.16 mm
|
|
|
|
Compare DPSD64ME8WKY5-DP-XX08 with alternatives
Compare K4H510838B-NLB30 with alternatives