DPS8M464-45I
vs
5962-8685924WA
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
TWILIGHT TECHNOLOGY INC
PYRAMID SEMICONDUCTOR CORP
Package Description
DIP, DIP22,.4
CERAMIC, DIP-22
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
45 ns
35 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-XDMA-T22
R-GDIP-T22
Memory Density
65536 bit
65536 bit
Memory IC Type
SRAM MODULE
OTHER SRAM
Memory Width
4
4
Number of Functions
1
1
Number of Terminals
22
22
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
16KX4
16KX4
Output Characteristics
3-STATE
3-STATE
Package Body Material
UNSPECIFIED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP22,.4
DIP22,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.00022 A
0.025 A
Standby Voltage-Min
2 V
4.5 V
Supply Current-Max
0.23 mA
0.09 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Number Matches
2
1
Part Package Code
DIP
Pin Count
22
Screening Level
MIL-STD-883
Compare DPS8M464-45I with alternatives
Compare 5962-8685924WA with alternatives