DPS8M464-35M vs 5962-8685923WA feature comparison

DPS8M464-35M B&B Electronics Manufacturing Company

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5962-8685923WA Pyramid Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer DPAC TECHNOLOGIES CORP PYRAMID SEMICONDUCTOR CORP
Package Description DIP, DIP22,.4 CERAMIC, DIP-22
Reach Compliance Code unknown compliant
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 35 ns
I/O Type COMMON COMMON
JESD-30 Code R-XDMA-T22 R-GDIP-T22
JESD-609 Code e0
Memory Density 65536 bit 65536 bit
Memory IC Type SRAM MODULE OTHER SRAM
Memory Width 4 4
Number of Functions 1 1
Number of Ports 1
Number of Terminals 22 22
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 16KX4 16KX4
Output Characteristics 3-STATE 3-STATE
Output Enable NO
Package Body Material UNSPECIFIED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP22,.4 DIP22,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B (Modified) MIL-STD-883
Standby Current-Max 0.0013 A 0.001 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.235 mA 0.09 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 1
Part Package Code DIP
Pin Count 22

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Compare 5962-8685923WA with alternatives