DPS8M464-35M vs DPS8M464-25I feature comparison

DPS8M464-35M B&B Electronics Manufacturing Company

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DPS8M464-25I B&B Electronics Manufacturing Company

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Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer DPAC TECHNOLOGIES CORP DPAC TECHNOLOGIES CORP
Package Description DIP, DIP22,.4 DIP, DIP22,.4
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 25 ns
I/O Type COMMON COMMON
JESD-30 Code R-XDMA-T22 R-XDMA-T22
JESD-609 Code e0 e0
Memory Density 65536 bit 65536 bit
Memory IC Type SRAM MODULE SRAM MODULE
Memory Width 4 4
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 22 22
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 16KX4 16KX4
Output Characteristics 3-STATE 3-STATE
Output Enable NO NO
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIP DIP
Package Equivalence Code DIP22,.4 DIP22,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B (Modified)
Standby Current-Max 0.0013 A 0.00022 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.235 mA 0.23 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 2

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