DPS8M464-35B
vs
5962-8685924WA
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
DPAC TECHNOLOGIES CORP
|
PYRAMID SEMICONDUCTOR CORP
|
| Package Description |
,
|
CERAMIC, DIP-22
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
35 ns
|
35 ns
|
| JESD-30 Code |
R-XDMA-T22
|
R-GDIP-T22
|
| Memory Density |
65536 bit
|
65536 bit
|
| Memory IC Type |
SRAM MODULE
|
OTHER SRAM
|
| Memory Width |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
|
| Number of Terminals |
22
|
22
|
| Number of Words |
16384 words
|
16384 words
|
| Number of Words Code |
16000
|
16000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
16KX4
|
16KX4
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Enable |
NO
|
|
| Package Body Material |
UNSPECIFIED
|
CERAMIC, GLASS-SEALED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
22
|
| I/O Type |
|
COMMON
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP22,.4
|
| Screening Level |
|
MIL-STD-883
|
| Standby Current-Max |
|
0.025 A
|
| Standby Voltage-Min |
|
4.5 V
|
| Supply Current-Max |
|
0.09 mA
|
| Terminal Pitch |
|
2.54 mm
|
|
|
|
Compare DPS8M464-35B with alternatives
Compare 5962-8685924WA with alternatives