DPS1MX8MKN3-35I
vs
WS1M8-100CIA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
DPAC TECHNOLOGIES CORP
MICROSEMI CORP
Part Package Code
MODULE
DIP
Package Description
DIP, DIP32,.6
DIP,
Pin Count
32
32
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
100 ns
I/O Type
COMMON
JESD-30 Code
R-CDMA-T32
R-CDIP-T32
JESD-609 Code
e0
e0
Memory Density
8388608 bit
8388608 bit
Memory IC Type
SRAM MODULE
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
Number of Terminals
32
32
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1MX8
1MX8
Output Characteristics
3-STATE
Output Enable
NO
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP32,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.0016 A
Standby Voltage-Min
2 V
Supply Current-Max
0.24 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
2
Pbfree Code
Seated Height-Max
5.13 mm
Compare DPS1MX8MKN3-35I with alternatives
Compare WS1M8-100CIA with alternatives