DPS1MX8MKN3-35C vs WS1M8V-17CI feature comparison

DPS1MX8MKN3-35C Twilight Technology Inc

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WS1M8V-17CI Microsemi Corporation

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer TWILIGHT TECHNOLOGY INC MICROSEMI CORP
Part Package Code MODULE DIP
Package Description DIP, DIP32,.6 DIP,
Pin Count 32 32
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 17 ns
I/O Type COMMON
JESD-30 Code R-CDMA-T32 R-CDIP-T32
Memory Density 8388608 bit 8388608 bit
Memory IC Type SRAM MODULE STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1MX8 1MX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.0006 A
Standby Voltage-Min 2 V
Supply Current-Max 0.23 mA
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 1 2
JESD-609 Code e4
Terminal Finish GOLD

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