Memory
DPS1MX8MKN3-35C
Description: SRAM Module, 1MX8, 35ns, CMOS, CDMA32, 0.600 INCH, DIP-32

Overview of DPS1MX8MKN3-35C by Twilight Technology Inc

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Consumer Electronics Education and Research Environmental Monitoring Industrial Automation Audio and Video Systems Agriculture Technology Medical Imaging Entertainment and Gaming

Available Datasheets

Part # Manufacturer Description Datasheet
R0K521350S000BE Renesas Electronics Corporation Renesas Starter Kit for R8C/35C (Discontinued product)

CAD Models for DPS1MX8MKN3-35C by Twilight Technology Inc
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Part Data Attributes for DPS1MX8MKN3-35C by Twilight Technology Inc

DPS1MX8MKN3-35C
Twilight Technology Inc
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Contact Manufacturer
Ihs Manufacturer
TWILIGHT TECHNOLOGY INC
Part Package Code
MODULE
Package Description
DIP, DIP32,.6
Pin Count
32
Reach Compliance Code
unknown
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
35 ns
I/O Type
COMMON
JESD-30 Code
R-CDMA-T32
Memory Density
8388608 bit
Memory IC Type
SRAM MODULE
Memory Width
8
Number of Functions
1
Number of Terminals
32
Number of Words
1048576 words
Number of Words Code
1000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
1MX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
Package Equivalence Code
DIP32,.6
Package Shape
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Standby Current-Max
0.0006 A
Standby Voltage-Min
2 V
Supply Current-Max
0.23 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Want to compare parts?
  1. DPS1MX8MKN3-35C
    Twilight Technology Inc
    SRAM Module, 1MX8, 35ns, CMOS, CDMA32, 0.600 INCH, DIP-32
    VS

Alternate Parts for DPS1MX8MKN3-35C

This table gives cross-reference parts and alternative options found for DPS1MX8MKN3-35C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPS1MX8MKN3-35C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
DPS1MX8MKN3-35M SRAM Module, 1MX8, 35ns, CMOS, CDMA32, 0.600 INCH, DIP-32 B&B Electronics Manufacturing Company DPS1MX8MKN3-35C vs DPS1MX8MKN3-35M
DPS1MX8MKN3-35I SRAM Module, 1MX8, 35ns, CMOS, CDMA32, 0.600 INCH, DIP-32 B&B Electronics Manufacturing Company DPS1MX8MKN3-35C vs DPS1MX8MKN3-35I
DPS1MX8MKN3-35M SRAM Module, 1MX8, 35ns, CMOS, CDMA32, 0.600 INCH, DIP-32 Twilight Technology Inc DPS1MX8MKN3-35C vs DPS1MX8MKN3-35M
DPS1MX8MKN3-35I SRAM Module, 1MX8, 35ns, CMOS, CDMA32, 0.600 INCH, DIP-32 Twilight Technology Inc DPS1MX8MKN3-35C vs DPS1MX8MKN3-35I
DPS1MX8MKN3-35B SRAM Module, 1MX8, 35ns, CMOS, CDMA32, 0.600 INCH, DIP-32 Twilight Technology Inc DPS1MX8MKN3-35C vs DPS1MX8MKN3-35B
DPS1MX8MKN3-35C SRAM Module, 1MX8, 35ns, CMOS, CDMA32, 0.600 INCH, DIP-32 B&B Electronics Manufacturing Company DPS1MX8MKN3-35C vs DPS1MX8MKN3-35C
DPS1MX8MKN3-35MA Standard SRAM, 1MX8, 35ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, CERAMIC, SLCC, DIP-32 B&B Electronics Manufacturing Company DPS1MX8MKN3-35C vs DPS1MX8MKN3-35MA
Part Number Description Manufacturer Compare
WS1M8V-35CMA Standard SRAM, 1MX8, 35ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation DPS1MX8MKN3-35C vs WS1M8V-35CMA
DPS1MX8MKN3-25CA Standard SRAM, 1MX8, 25ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, CERAMIC, SLCC, DIP-32 B&B Electronics Manufacturing Company DPS1MX8MKN3-35C vs DPS1MX8MKN3-25CA
WS1M8-45CC Standard SRAM, 1MX8, 45ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation DPS1MX8MKN3-35C vs WS1M8-45CC
WS1M8V-100CC Standard SRAM, 1MX8, 100ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation DPS1MX8MKN3-35C vs WS1M8V-100CC
WS1M8V-17CI Standard SRAM, 1MX8, 17ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation DPS1MX8MKN3-35C vs WS1M8V-17CI
WS1M8-55CI Standard SRAM, 1MX8, 55ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation DPS1MX8MKN3-35C vs WS1M8-55CI
DPS1MS8MP-70I SRAM Module, 1MX8, 70ns, CMOS, CDMA32, 0.600 INCH, DIP-32 Twilight Technology Inc DPS1MX8MKN3-35C vs DPS1MS8MP-70I
WS1M8-25CC Standard SRAM, 1MX8, 25ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation DPS1MX8MKN3-35C vs WS1M8-25CC
WS1M8L-55CC Standard SRAM, 1MX8, 55ns, CMOS, CDIP32, SIDE BRAZED, CERAMIC, DIP-32 White Microelectronics DPS1MX8MKN3-35C vs WS1M8L-55CC
WS1M8-17CI Standard SRAM, 1MX8, 17ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation DPS1MX8MKN3-35C vs WS1M8-17CI

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