DPS1MX8MKN3-25I vs DPS1MX8MKN3-25CA feature comparison

DPS1MX8MKN3-25I Twilight Technology Inc

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DPS1MX8MKN3-25CA B&B Electronics Manufacturing Company

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Active Transferred
Ihs Manufacturer TWILIGHT TECHNOLOGY INC DPAC TECHNOLOGIES CORP
Part Package Code MODULE DIP
Package Description DIP, DIP32,.6 ADIP,
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
I/O Type COMMON
JESD-30 Code R-CDMA-T32 R-CDIP-T32
Memory Density 8388608 bit 8388608 bit
Memory IC Type SRAM MODULE STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 1MX8 1MX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP ADIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY IN-LINE, PIGGYBACK
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.0016 A
Standby Voltage-Min 2 V
Supply Current-Max 0.24 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 1 1
Length 41.402 mm
Seated Height-Max 7.2644 mm
Width 15.24 mm

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