DPS1MK32MKV3-25B
vs
DPS1MK32MKV3-35C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
DPAC TECHNOLOGIES CORP
DPAC TECHNOLOGIES CORP
Part Package Code
PGA
PGA
Package Description
PGA, PGA66,11X11
1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66
Pin Count
66
66
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
35 ns
Additional Feature
USER CONFIGURABLE AS 4M X 8
USER CONFIGURABLE AS 4M X 8
Alternate Memory Width
16
16
I/O Type
COMMON
COMMON
JESD-30 Code
S-CPGA-P66
S-CPGA-P66
JESD-609 Code
e0
e0
Memory Density
33554432 bit
33554432 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
32
32
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
66
66
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
1MX32
1MX32
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
YES
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
PGA
Package Equivalence Code
PGA66,11X11
PGA66,11X11
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
9.144 mm
9.144 mm
Standby Current-Max
0.0144 A
0.0024 A
Standby Voltage-Min
2 V
2 V
Supply Current-Max
0.96 mA
0.92 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
PERPENDICULAR
PERPENDICULAR
Base Number Matches
2
2
Compare DPS1MK32MKV3-25B with alternatives
Compare DPS1MK32MKV3-35C with alternatives