DPS128X32BV3-30I vs 5962-3829451MZX feature comparison

DPS128X32BV3-30I B&B Electronics Manufacturing Company

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5962-3829451MZX Micross Components

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer DPAC TECHNOLOGIES CORP AUSTIN SEMICONDUCTOR INC
Part Package Code PGA DIP
Package Description PGA, PGA66,11X11 CERAMIC, DIP-28
Pin Count 66 28
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 30 ns 45 ns
Additional Feature USER CONFIGURABLE AS 512K X 8
Alternate Memory Width 16
I/O Type COMMON
JESD-30 Code S-CPGA-P66 R-GDIP-T28
JESD-609 Code e0
Memory Density 4194304 bit 65536 bit
Memory IC Type SRAM MODULE STANDARD SRAM
Memory Width 32 8
Number of Functions 1 1
Number of Ports 1
Number of Terminals 66 28
Number of Words 131072 words 8192 words
Number of Words Code 128000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 128KX32 8KX8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code PGA DIP
Package Equivalence Code PGA66,11X11
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 6.4008 mm
Standby Current-Max 0.0016 A
Standby Voltage-Min 2 V
Supply Current-Max 0.56 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form PIN/PEG THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position PERPENDICULAR DUAL
Base Number Matches 2 2

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