DPS1026-25M
vs
EDH816H64C55C9B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
DPAC TECHNOLOGIES CORP
ELECTRONIC DESIGNS INC
Package Description
DIP, DIP40,.9
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Access Time-Max
25 ns
55 ns
Additional Feature
CONFIGURABLE AS 64K X 16
CONFIGURABLE AS 64K X 16
Alternate Memory Width
8
4
I/O Type
COMMON
JESD-30 Code
R-XDMA-T40
R-XDMA-T40
JESD-609 Code
e0
Memory Density
1048576 bit
1048576 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
4
8
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
40
40
Number of Words
262144 words
131072 words
Number of Words Code
256000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
256KX4
128KX8
Output Characteristics
3-STATE
3-STATE
Output Enable
NO
NO
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIP
Package Equivalence Code
DIP40,.9
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.4 A
Standby Voltage-Min
4.5 V
Supply Current-Max
2.24 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Compare DPS1026-25M with alternatives
Compare EDH816H64C55C9B with alternatives