EDH816H64C55C9B
vs
DPS1027-25C
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ELECTRONIC DESIGNS INC
DPAC TECHNOLOGIES CORP
Reach Compliance Code
unknown
unknown
Access Time-Max
55 ns
25 ns
Additional Feature
CONFIGURABLE AS 64K X 16
CONFIGURABLE AS 64K X 16
Alternate Memory Width
4
8
JESD-30 Code
R-XDMA-T40
R-XDMA-T40
Memory Density
1048576 bit
1048576 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
8
4
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
40
40
Number of Words
131072 words
262144 words
Number of Words Code
128000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
128KX8
256KX4
Output Characteristics
3-STATE
3-STATE
Output Enable
NO
NO
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
1
2
Rohs Code
Package Description
DIP, DIP40,.9
ECCN Code
EAR99
HTS Code
8542.32.00.41
I/O Type
COMMON
JESD-609 Code
e0
Package Code
DIP
Package Equivalence Code
DIP40,.9
Standby Current-Max
0.4 A
Standby Voltage-Min
4.5 V
Supply Current-Max
2.24 mA
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
2.54 mm
Compare EDH816H64C55C9B with alternatives
Compare DPS1027-25C with alternatives