HD63485CP32 vs HD63485CP64 feature comparison

HD63485CP32 Hitachi Ltd

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HD63485CP64 Hitachi Ltd

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HITACHI LTD HITACHI LTD
Part Package Code LCC LCC
Package Description QCCJ, LDCC68,1.0SQ QCCJ, LDCC68,1.0SQ
Pin Count 68 68
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 19 19
Boundary Scan NO NO
External Data Bus Width
JESD-30 Code S-PQCC-J68 S-PQCC-J68
JESD-609 Code e0 e0
Length 24.2 mm 24.2 mm
Low Power Mode NO NO
Number of Banks 1 1
Number of Terminals 68 68
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC68,1.0SQ LDCC68,1.0SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.6 mm 4.6 mm
Supply Current-Max 160 mA 160 mA
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology BICMOS BICMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 24.2 mm 24.2 mm
uPs/uCs/Peripheral ICs Type MEMORY CONTROLLER, DRAM MEMORY CONTROLLER, DRAM
Base Number Matches 1 1

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