DM74S571BN vs M38510/20404BEX feature comparison

DM74S571BN National Semiconductor Corporation

Buy Now Datasheet

M38510/20404BEX QP Semiconductor

Buy Now
Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP QP SEMICONDUCTOR INC
Package Description DIP, DIP16,.3 DIP,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 35 ns 35 ns
JESD-30 Code R-PDIP-T16 R-XDIP-T16
JESD-609 Code e0
Length 21.755 mm
Memory Density 2048 bit 2048 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 4 4
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 512X4 512X4
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Current-Max 0.13 mA
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 2 4
Part Package Code DIP
Pin Count 16

Compare DM74S571BN with alternatives

Compare M38510/20404BEX with alternatives