DM54S572AJ vs AM27S32FC feature comparison

DM54S572AJ Texas Instruments

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AM27S32FC AMD

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP ADVANCED MICRO DEVICES INC
Part Package Code DIP DFP
Package Description DIP, DIP18,.3 DFP, FL18,.3
Pin Count 18 18
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 60 ns 250 ns
JESD-30 Code R-GDIP-T18 R-CDFP-F18
JESD-609 Code e0 e0
Memory Density 4096 bit 33554432 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 4 8
Number of Functions 1 1
Number of Terminals 18 18
Number of Words 1024 words 1024 words
Number of Words Code 1000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 75 °C
Operating Temperature-Min -55 °C
Organization 1KX4 4MX8
Output Characteristics OPEN-COLLECTOR OPEN-COLLECTOR
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DFP
Package Equivalence Code DIP18,.3 FL18,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE FLATPACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 2.286 mm
Supply Current-Max 0.14 mA
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY COMMERCIAL EXTENDED
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE FLAT
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 9.525 mm
Base Number Matches 4 2
Length 9.779 mm

Compare DM54S572AJ with alternatives

Compare AM27S32FC with alternatives