DM54LS00J
vs
TC74HC03AF-EL
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
TOSHIBA CORP
Package Description
DIP,
SOP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
HC/UH
JESD-30 Code
R-GDIP-T14
R-PDSO-G14
Length
19.43 mm
10.3 mm
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
15 ns
19 ns
Seated Height-Max
5.08 mm
1.9 mm
Supply Voltage-Max (Vsup)
5.5 V
6 V
Supply Voltage-Min (Vsup)
4.5 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
TTL
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
5.3 mm
Base Number Matches
4
1
Pbfree Code
Rohs Code
Part Package Code
SOIC
Pin Count
14
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Output Characteristics
OPEN-DRAIN
Qualification Status
Not Qualified
Terminal Finish
TIN LEAD
Compare DM54LS00J with alternatives
Compare TC74HC03AF-EL with alternatives