TC74HC03AF-EL
vs
DV74LS00N
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TOSHIBA CORP
AVG SEMICONDUCTORS
Part Package Code
SOIC
DIP
Package Description
SOP,
DIP, DIP14(UNSPEC)
Pin Count
14
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
LS
JESD-30 Code
R-PDSO-G14
R-PDIP-T14
JESD-609 Code
e0
Length
10.3 mm
18.86 mm
Load Capacitance (CL)
50 pF
15 pF
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
-10 °C
Output Characteristics
OPEN-DRAIN
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Propagation Delay (tpd)
19 ns
15 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.9 mm
4.69 mm
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
TTL
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
5.3 mm
7.62 mm
Base Number Matches
1
1
Max I(ol)
0.008 A
Package Equivalence Code
DIP14(UNSPEC)
Power Supply Current-Max (ICC)
4.4 mA
Prop. Delay@Nom-Sup
15 ns
Schmitt Trigger
NO
Compare TC74HC03AF-EL with alternatives
Compare DV74LS00N with alternatives