DM385AAAR21
vs
DM385AAARD21F
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
LFBGA, BGA609,31X31,20
|
LFBGA, BGA609,31X31,20
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
5A992.C
|
5A992.C
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
28
|
28
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
30 MHz
|
30 MHz
|
External Data Bus Width |
16
|
16
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B609
|
S-PBGA-B609
|
JESD-609 Code |
e1
|
e1
|
Length |
16 mm
|
16 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
609
|
609
|
Operating Temperature-Max |
95 °C
|
95 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Equivalence Code |
BGA609,31X31,20
|
BGA609,31X31,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (words) |
8192
|
8192
|
Seated Height-Max |
1.32 mm
|
1.32 mm
|
Speed |
1000 MHz
|
1000 MHz
|
Supply Voltage-Max |
1.42 V
|
1.42 V
|
Supply Voltage-Min |
1.28 V
|
1.28 V
|
Supply Voltage-Nom |
1.35 V
|
1.35 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
16 mm
|
16 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
|
|
|
Compare DM385AAAR21 with alternatives
Compare DM385AAARD21F with alternatives