DM385AAARD21F
vs
TMS320DM8127SCYE3H
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Package Description
LFBGA, BGA609,31X31,20
FBGA,
Reach Compliance Code
compliant
compliant
ECCN Code
5A992.C
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
28
28
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
30 MHz
30 MHz
External Data Bus Width
16
16
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B609
S-PBGA-B684
JESD-609 Code
e1
e1
Length
16 mm
23 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
4
Number of Terminals
609
684
Operating Temperature-Max
95 °C
90 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
FBGA
Package Equivalence Code
BGA609,31X31,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel)
260
250
Qualification Status
Not Qualified
RAM (words)
8192
Seated Height-Max
1.32 mm
3.06 mm
Speed
1000 MHz
1000 MHz
Supply Voltage-Max
1.42 V
1.42 V
Supply Voltage-Min
1.28 V
1.28 V
Supply Voltage-Nom
1.35 V
1.35 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
TIN SILVER COPPER
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
16 mm
23 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Pbfree Code
Part Package Code
BGA
Pin Count
684
Compare DM385AAARD21F with alternatives
Compare TMS320DM8127SCYE3H with alternatives