DIP-308-001BLF
vs
LS308-01GG
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
FCI
|
ADVANCED INTERCONNECTIONS CORP
|
| Package Description |
LEAD FREE
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8536.69.40.40
|
8536.69.40.40
|
| Body Breadth |
0.4 inch
|
0.4 inch
|
| Body Depth |
0.165 inch
|
0.165 inch
|
| Body Length |
0.3 inch
|
0.4 inch
|
| Contact Finish Mating |
GOLD (30) OVER NICKEL
|
GOLD OVER NICKEL
|
| Contact Finish Termination |
GOLD OVER NICKEL
|
Gold (Au) - with Nickel (Ni) barrier
|
| Contact Material |
NOT SPECIFIED
|
BERYLLIUM COPPER
|
| Contact Style |
RND PIN-SKT
|
RND PIN-SKT
|
| Device Socket Type |
IC SOCKET
|
IC SOCKET
|
| Device Type Used On |
DIP8
|
DIP8
|
| Housing Material |
GLASS FILLED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER
|
POLYBUTYLENE TEREPHTHALATE
|
| JESD-609 Code |
e4
|
e4
|
| Mating Contact Pitch |
0.1 inch
|
0.1 inch
|
| Mounting Style |
STRAIGHT
|
STRAIGHT
|
| Number of Contacts |
8
|
8
|
| PCB Contact Pattern |
RECTANGULAR
|
RECTANGULAR
|
| PCB Contact Row Spacing |
0.30000000000000004 mm
|
0.30000000000000004 mm
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Termination Type |
SOLDER
|
SOLDER
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
STANDARD: UL 94V-0, LOW PROFILE
|
| Contact Configuration |
|
RECTANGLE
|
| Operating Temperature-Max |
|
140 °C
|
| Operating Temperature-Min |
|
-60 °C
|
|
|
|
Compare DIP-308-001BLF with alternatives
Compare LS308-01GG with alternatives