DG212BDY
vs
HI1-5051-2
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
SILICONIX INC
|
INTERSIL CORP
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
SOP, SOP16,.25
|
DIP, DIP16,.3
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Vishay
|
|
| Analog IC - Other Type |
SPST
|
SPDT
|
| JESD-30 Code |
R-PDSO-G16
|
R-GDIP-T16
|
| JESD-609 Code |
e0
|
e0
|
| Normal Position |
NO
|
|
| Number of Functions |
4
|
2
|
| Number of Terminals |
16
|
16
|
| On-state Resistance-Max (Ron) |
200 Ω
|
45 Ω
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output |
SEPARATE OUTPUT
|
SEPARATE OUTPUT
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP16,.25
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
NO
|
| Switch-on Time-Max |
300 ns
|
500 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
4
|
1
|
| ECCN Code |
|
EAR99
|
| Neg Supply Voltage-Nom (Vsup) |
|
-15 V
|
| Number of Channels |
|
1
|
| Off-state Isolation-Nom |
|
80 dB
|
| On-state Resistance Match-Nom |
|
1 Ω
|
| Seated Height-Max |
|
5.08 mm
|
| Supply Voltage-Nom (Vsup) |
|
15 V
|
| Switch-off Time-Max |
|
500 ns
|
| Width |
|
7.62 mm
|
|
|
|
Compare DG212BDY with alternatives
Compare HI1-5051-2 with alternatives