DG188BP
vs
DG191AP/883
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
VISHAY SILICONIX
Package Description
DIP, DIP14,.3
DIP,
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SPDT
SPDT
JESD-30 Code
R-CDIP-T14
R-XDIP-T16
JESD-609 Code
e0
e0
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Number of Channels
1
1
Number of Functions
1
2
Number of Terminals
14
16
Off-state Isolation-Nom
50 dB
50 dB
On-state Resistance-Max (Ron)
100 Ω
75 Ω
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-20 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
UNSPECIFIED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
NO
NO
Switch-off Time-Max
150 ns
130 ns
Switch-on Time-Max
300 ns
250 ns
Switching
BREAK-BEFORE-MAKE
Technology
JFET
BIPOLAR
Temperature Grade
OTHER
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
4
3
Part Package Code
DIP
Pin Count
16
Additional Feature
FAULT PROTECTED
Length
20.32 mm
Moisture Sensitivity Level
1
Screening Level
MIL-STD-883
Seated Height-Max
4.44 mm
Width
7.62 mm
Compare DG188BP with alternatives
Compare DG191AP/883 with alternatives