DG191AP/883
vs
JM38510/11108BEC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
VISHAY SILICONIX
HARRIS SEMICONDUCTOR
Part Package Code
DIP
Package Description
DIP,
DIP,
Pin Count
16
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
FAULT PROTECTED
FAULT PROTECTED
Analog IC - Other Type
SPDT
SPDT
JESD-30 Code
R-XDIP-T16
R-XDIP-T16
JESD-609 Code
e0
Length
20.32 mm
20.32 mm
Moisture Sensitivity Level
1
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Number of Channels
1
1
Number of Functions
2
2
Number of Terminals
16
16
Off-state Isolation-Nom
50 dB
50 dB
On-state Resistance-Max (Ron)
75 Ω
75 Ω
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
MIL-M-38510 Class B
Seated Height-Max
4.44 mm
4.44 mm
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
NO
NO
Switch-off Time-Max
130 ns
130 ns
Switch-on Time-Max
250 ns
250 ns
Technology
BIPOLAR
BIPOLAR
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
3
2
Compare DG191AP/883 with alternatives
Compare JM38510/11108BEC with alternatives