DAC1408D750HN-C18
vs
DAC1658D1G0NLGA8
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
VFQFPN
|
VFQFPN
|
Package Description |
9 X 9 MM, 0.85 MM HEIGHT, PLASTIC, SOT804-3, HVQFN-64
|
VFQFP-56
|
Pin Count |
64
|
56
|
Manufacturer Package Code |
NLG64
|
NLG56P1
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Output Voltage-Max |
3.47 V
|
3.45 V
|
Analog Output Voltage-Min |
1.8 V
|
2.15 V
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
Input Format |
SERIAL
|
SERIAL
|
JESD-30 Code |
S-PQCC-N64
|
S-XQCC-N56
|
JESD-609 Code |
e3
|
e3
|
Length |
9 mm
|
8 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Bits |
14
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
64
|
56
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
1 mm
|
0.9 mm
|
Settling Time-Nom (tstl) |
0.02 µs
|
0.02 µs
|
Supply Voltage-Nom |
1.8 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
TIN
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
9 mm
|
8 mm
|
Base Number Matches |
1
|
1
|
Package Equivalence Code |
|
LCC56,.31SQ,20
|
|
|
|
Compare DAC1408D750HN-C18 with alternatives
Compare DAC1658D1G0NLGA8 with alternatives